Why Choose Asscon Vapor Phase Machines?
Benefits of Vapor Phase:
Vapor Phase (VP) reflow is an advanced PCB soldering technology that uses an inert liquid with a high boiling point. In recent years, Vapor Phase technology has gained MASSIVE popularity among large-scale PCB assemblers.
Nowadays, components are so small and intricate and manufacturers usually require high temperatures for soldering. It’s an everchanging and always complex problem that Vapor Phase has sent out to fix.
In the end, PCB assemblers and Electronics manufacturing companies can get the highest possible and most reliable PCB soldering results through Vapor Phase reflow and additional vacuum processes.
You can check out our smaller Vapor Phase machines here. For more information about our larger Vapor Phase capital equipment, you can check out our other website here.
How does Vapor Phase work?
There are three main principles of Vapor Phase Reflow:
1st Principle: Heat Adjustment
This process involves engineers calculating/adjusting the temperature gradients within the Vapor Phase equipment. This happens when regulating the power that goes to the respective equipment’s heating elements. More power = more heat, vice versa. This allows for more heat transfer to the PCB while the liquid’s boiling point remains the same. For more information about the necessary fluid used you can check out our blog here.
If you would like to buy Vapor Phase Fluid you can do so here.
2nd Principle: Level Adjustment
Arguably the most beneficial thing about Vapor Phase soldering is that it allows you to control immediate temperature gradients. You must know that you need to ideally preheat the PCB board. To do that you hold it at the respective depth needed for your requirements. From there, you can lower it into the Vapor chamber and let it get soldered. PCB assemblers and designers can really create whatever thermal profile necessary for their respective processes. This can be done automatically through the onboard PLC.
3rd Principle: Void Formation
With any soldering, but especially vapor phase soldering, void formation is inevitable. These voids can compromise the PCB joint’s thermal and electrical conductivity. Arguably the best way to get rid of voids is with a vacuum-controlled procedure. Below is a beautiful diagram of what I would take paragraphs to explain. Take a look!
If you need any oven cleaning materials for your Vapor Phase soldering equipment (or any soldering equipment for that matter) you can check out our oven cleaning products.
Have some questions?
A-Tek representatives will do their best to help you with any problem or question you may have or redirect you to the proper individuals who can.